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Semiconductor Assembly - List of Manufacturers, Suppliers, Companies and Products

Semiconductor Assembly Product List

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Business Services - Semiconductor Assembly

Business Services - Semiconductor Assembly

Uncompromising quality and cost performance.

Ars Electronics provides semiconductor assembly solutions that achieve uncompromising quality and high cost performance at a high level. We manufacture advanced processes such as dicing, die attach, wire bonding, mold encapsulation, and final testing for semiconductors (IC/LSI) using state-of-the-art equipment. Within a consistent production system, we respond flexibly and optimally to our customers' diverse needs.

  • Other semiconductors

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Semiconductor assembly (post-manufacturing process of semiconductors)

Semiconductor assembly (post-manufacturing process of semiconductors)

Consistent production for semiconductor manufacturing (back-end process)! Providing manufacturing services related to manufacturing.

We would like to introduce our "Semiconductor Assembly (Post-Process of Semiconductor Manufacturing)." We have extensive experience in manufacturing support for modules that incorporate electronic components such as power semiconductors and COBs, and we also offer services that combine printed circuit board assembly. We handle everything from semiconductor wafer dicing to packaging, contributing to the resolution of challenges related to semiconductor assembly. Please feel free to contact us when you need our services. 【Features】 ■ Integrated production of semiconductor assembly ■ Support for solving challenges in semiconductor assembly ■ Consistent production from product prototyping to mass production *For more details, please refer to the related links or feel free to contact us.

  • Other semiconductors

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Semiconductor assembly and packaging implementation

Semiconductor assembly and packaging implementation

We perform assembly and packaging of semiconductors (communication systems/MEMS, etc.). We also offer rework services. There is a vacuum reflow available.

In the 3rd Business Division (formerly the Electronic Device Division), we receive semiconductor chips (silicon-based, compound semiconductors, MEMS, etc.) from our customers and carry out assembly and inspection for ceramic packages and other applications. We also have experience in COB (Chip on Board) assembly, where chips are directly mounted onto substrates. 【Features】 - Prototyping is possible, as well as mass production with single processes. - We can handle chips that are difficult to manage and prone to cracking or chipping with care. For more details, please contact us or download the catalog.

  • Other semiconductors

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